O3neida-IEC 61499 Booth at SPS/IPC/DRIVES 2012
IEC 1499 users interested in this initiative and willing to rent demo wall space are invited to contact Antonio Valentini, who coordinates this activity, at: email@example.com.
O3neida cosponsors some conferences such as the IEEE-IES INDIN series and participates in others such as HoloMAS. Smart Assembly, Interoperability and Automation Objects Development Framework are proposed conferences to be cosponsored by O3neida. Other partners include ISA, and possibly NIST, IEC / ISO and others to be determined.